SiLC Raises $25m for LiDAR Sensor

20 November 2023
GeoSpatial World

AI Generated Summary

SiLC Technologies has received an additional $25 million in funding, bringing its total to $56 million from its Seed and Series A.

The company’s on-chip FFAW LIDAR, which is competitive in terms of sensor performance, chip integration, and manufacturing know-how, is set to bridge the AI gap for machine vision.

New strategic participants in the round include Hokuyo Automatic, Hankook & Company, and ROHM Semiconductor, all industry leaders with a focus on industrial, robotics, and mobility vision.