Rapidus and IBM Expand Collaborate on Semiconductor Tech

04 June 2024
GeoSpatial World

AI Generated Summary

IBM and Rapidus have announced a joint development partnership to develop chiplet technology for high-performance computer systems.

The partnership will involve R&D and manufacturing at IBM’s North America facilities, with Rapidus receiving packaging technology from IBM.

The move is part of a broader initiative to increase Japan’s role in the semiconductor packaging supply chain.